Printed circuits:	1-layer 2-layer multi-layers aluminum (metal core laminate)
Base materials used:	CEM1, FR3, FR4, FR5
Material thickness:	0.55 to 3.2 mm
Cu thickness:	18, 35, 70, 105, 210 µm
Max. size:	500 x 600 mm
Width of tracks and insulation spaces:	120 µm
Min. hole diameter:	0.3 mm
Surface finish:	Lead-free HAL OSP (organic surface protection) Au (chemical and galvanic) Sn (chemical) Graphite (carbon paste)
Solder mask:	green black white blue red
Standard printing:	white yellow black
Peelable mask:	for lead solder for lead-free solder
Tooling:	cutting grooving milling
Input data – motifs:	GERBER 274X CAM 350 ver.6 and highher EAGLE 3.55 and highher
Input data – drilling:	Siebmayer Excellon

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